Used TEL CELLESTA™ MS2

The TEL CELLESTA™ MS2 is a fully automated, single-wafer cleaning system designed for 300mm wafers. It is engineered for high-purity cleaning of ultra-fine patterns in advanced logic and memory manufacturing processes.

Core Focus: Precision Surface Treatment

The system utilizes a single-wafer rotating architecture, where each wafer is held on a chuck and subjected to sequential chemical dispensing, rinsing, and drying. This single-wafer approach eliminates cross-contamination and allows for precise control over chemical reaction times, meeting the stringent defect-rate requirements of advanced technology nodes.

Key Technical Features

Optimized Fluid and Drying Control: The process chamber is precision-engineered for airflow and drainage management. Combined with sophisticated rinsing and drying protocols, it effectively prevents the formation of watermarks and the re-deposition of particles.

Versatile Chemical Compatibility: The system supports the mixing and delivery of various chemicals—such as SC1, diluted HF, and ozonated water (O₃ water)—addressing diverse cleaning requirements for post-CMP, post-etch, and pre-bonding applications.

High-Throughput Automation: Equipped with standard FOUP loading/unloading and SECS/GEM communication capabilities, the system delivers high throughput and integrates seamlessly into fully automated 300mm high-volume production lines.

Summary

With its precise fluid control and high stability, the CELLESTA™ MS2 serves as a critical wet-processing tool in 300mm production lines, ensuring consistent cleaning performance and improved manufacturing yields.