Used KE VR70 Optical Metrology System

The KE VR70 (by Kokusai Electric) is a high-precision optical metrology system designed for front-end semiconductor wafer manufacturing. It is primarily used for process monitoring and quality control in conjunction with thin-film deposition processes (such as CVD and oxidation).

Core Function: Thin-Film and Surface Topography Metrology

In semiconductor production lines, the KE VR70 serves as an optical film-thickness gauge or surface topography inspection tool. Utilizing non-contact optical measurement technology, it performs high-precision analysis of thin-film thickness, reflectivity, and surface uniformity on wafers, ensuring that films processed in equipment such as thermal furnaces meet required quality standards.

Key Technical Features

Non-Contact, Non-Destructive Measurement: Employs spectral reflectance or interferometry, eliminating the need for physical contact with the wafer surface. This prevents scratches and particle contamination, ensuring full compliance with the stringent cleanliness requirements of semiconductor fabrication facilities (Fabs).

Fully Automated, High-Throughput Operation: Equipped with an automated wafer-handling system (compatible with FOUPs or open wafer cassettes), it supports fully automated, multi-point thickness mapping with high throughput.

Intelligent Process Closed-Loop Control: Supports the SECS/GEM communication protocol, allowing measurement data to be transmitted in real-time to MES (Manufacturing Execution System) or SPC (Statistical Process Control) systems. This facilitates rapid feedback control (Run-to-Run) for front-end thermal processing and deposition operations.

Summary

With its high-precision, non-contact optical metrology capabilities and full automation integration, the KE VR70 serves as a critical metrology and inspection (M&I) tool in front-end semiconductor manufacturing, essential for maintaining the stability of thin-film deposition processes and improving product yield.