Used TEL IW-6D Wafer Vertical Diffusion Furnace

The TEL IW-6D is a vertical diffusion furnace designed for wafers 6 inches (150 mm) in diameter or smaller. As part of TEL’s thermal processing equipment portfolio for mature-node technologies, it is primarily utilized in research laboratories and small-scale, specialized production lines.

Core Positioning: A Thermal Processing Platform for Small-Diameter Wafers

Engineered for high-temperature processes such as oxidation and diffusion, the system typically supports oxidative diffusion and is compatible with process gases including H₂, O₂, and HCl. Its vertical architecture, combined with multi-zone temperature control, enables stable batch processing within a compact footprint.

Key Technical Features

Precise Multi-Zone Temperature Control: Utilizing a vertical heater array with adjustable temperature zones, the system ensures uniform temperature distribution across wafers, meeting the requirements for high-quality oxide layer growth.

Flexible Gas and Process Configuration: Equipped with an integrated gas analysis system and adjustable gas inlets, the unit supports real-time process monitoring and off-line analysis; certain configurations can even be extended to support applications such as PECVD.

Automation and Remote Monitoring: Featuring a touchscreen interface and PLC-based control, the system supports remote monitoring and diagnostics via Ethernet, facilitating maintenance and the traceability of process data.

Summary

Leveraging the stable thermal processing capabilities of a vertical diffusion furnace, the IW-6D is designed for oxidation, diffusion, and similar processes on wafers 6 inches or smaller. It is a long-proven, reliable solution for R&D and small-batch production lines utilizing mature-node technologies.