Used Accretech W-GM-4200

The Accretech W-GM-4200 is a fully automated wafer grinding system designed primarily for the high-volume backside thinning of 300mm wafers.

Key Features

Dual-Spindle High-Efficiency Grinding: Equipped with separate spindles for rough and fine grinding, the system performs the entire thinning process in a single unit. This minimizes wafer transfers, thereby increasing throughput while reducing the risk of breakage when handling ultra-thin wafers.

High-Precision Control: Featuring in-line thickness measurement and a highly rigid structural design, the system ensures precise control over the grinding endpoint. This delivers excellent Total Thickness Variation (TTV) and superior surface quality, meeting the stringent thinning requirements of advanced packaging applications.

Full Automation Integration: The system comes standard with FOUP handling and automated loading/unloading, an integrated cleaning unit, and support for SECS/GEM communication, allowing for seamless integration into 300mm automated production lines.

Process Versatility: Suitable for silicon, compound semiconductors (SiC, GaN), and hard, brittle materials; also supports the TAIKO thinning process (optional).

Summary

The W-GM-4200 is a core production grinding tool from Accretech, designed for 300mm wafer manufacturing and advanced packaging lines. It strikes an optimal balance between dual-spindle grinding efficiency and processing precision, making it well-suited for high-throughput, high-yield mass production environments.