Used Lam Research TCP 9600

The Lam Research TCP 9600 is a fully automated, high-density plasma etching system designed for 200mm (8-inch) wafers. It belongs to Lam’s classic TCP 9600 platform—an upgraded successor to the TCP 9400 series.

Core Positioning: A Premier Workhorse for Dielectric and Silicon Etching

The system utilizes Lam’s proprietary Transformer Coupled Plasma (TCP™) technology, which generates high-density plasma at low pressures while allowing for independent control over ion density and bombardment energy. It is primarily used for the anisotropic etching of silicon dioxide, silicon nitride, and silicon-based materials, finding extensive application in the manufacturing of logic chips, memory devices, power semiconductors, and MEMS.

Key Technical Features

Optimized Plasma Source and Uniformity: Compared to its predecessor, the 9400, the 9600 features enhancements in RF matching, gas distribution, and chamber airflow design. These improvements significantly boost within-wafer uniformity (WiWNU) and provide superior control over etch profiles for 200mm wafers.

High-Precision Endpoint Detection: Equipped with advanced Optical Emission Spectroscopy (OES) or interferometric endpoint detection systems, the tool can precisely determine the etch endpoint. This protects underlying layers and meets the stringent requirements for high-selectivity and high-aspect-ratio processes.

High Throughput and Mature Ecosystem: Built on a proven, fully automated 200mm platform with support for SECS/GEM communication, the TCP 9600 boasts a large installed base across the industry. It benefits from a highly mature library of process recipes, as well as relatively low costs for spare parts and maintenance.

Summary

With its high-density plasma etching capabilities, optimized uniformity control, and mature, high-volume production platform, the TCP 9600 stands out as a highly cost-effective core dry-etching solution for 200mm legacy nodes and specialized process production lines.