Used PVA TePla TECHNICS 300 TL1000 etching machine

The PVA TePla TECHNICS 300 TL1000 is a semi-automatic/manual plasma etching and surface treatment system designed for R&D labs, pilot lines, and small-batch specialty process production lines.

Core Positioning: Flexible High-End R&D Platform

This equipment belongs to PVA TePla's classic TECHNICS series. The TL1000 typically represents a system equipped with larger or specialized chambers (such as tubular or large-size parallel plates) to accommodate special carriers, large substrates, or meet the commissioning needs of more complex processes. It employs manual/semi-automatic loading and unloading, providing process engineers with a high degree of freedom in parameter adjustment.

Key Technical Features

Dual-Mode Plasma Source: Supports both downstream and direct plasma modes. The downstream mode strips away high-energy ions, using only active free radicals for gentle processing without electrostatic damage, suitable for fragile compound semiconductors or packaged devices; the direct mode provides a higher etching rate.

Wide process compatibility: Compatible with gases such as O₂, Ar, CF₄, and SF₆, capable of performing photoresist removal (Ashing), organic cleaning, surface activation, and isotropic etching of materials such as silicon and silicon nitride.

High safety and vacuum control: The chamber, gas path, and exhaust gas treatment system are all designed for highly corrosive gases and equipped with a comprehensive safety interlock mechanism to ensure the safety of R&D operations.

Summary: The TECHNICS 300 TL1000, with its flexible process compatibility, gentle processing capabilities, and high degree of adjustment freedom, is an ideal plasma etching and surface treatment device for R&D laboratories and small-batch specialty process production lines.