Used Lam Research RAINBOW 4420 Etching Machine

The Lam Research RAINBOW 4420 is a fully automated plasma etching system designed for wafers 150mm (6 inches) in diameter or smaller; it is part of Lam’s classic Rainbow platform series.

Core Positioning: A Workhorse for Etching Small-Diameter Wafers

The Rainbow series boasts a massive installed base across production lines utilizing 6-inch or smaller wafers. The 4420 model primarily serves mature-node and specialty-process applications, specializing in the anisotropic dry etching of materials such as silicon, silicon dioxide, and silicon nitride. It is widely used in the manufacturing of power semiconductors, MEMS, optoelectronics, and discrete devices.

Key Technical Features

Proven Plasma Etching Capabilities: Equipped with a classic RF-driven system and gas distribution architecture, it delivers stable plasma density, ensuring precise control over etch rates and feature profiles—meeting the requirements for micron-scale processes.

Reliable Endpoint Detection and Uniformity: Features an integrated endpoint detection system (such as OES) for precise control of etch depth and protection of underlying layers. The chamber design is optimized for gas flow over smaller wafers, ensuring excellent within-wafer uniformity (WiWNU).

High Automation and Low Cost of Ownership: Comes standard with a fully automated wafer-handling system and supports SECS/GEM communication. Given the extensive installed base of the Rainbow platform, it benefits from a mature process ecosystem, readily available spare parts, and low maintenance costs.

Summary

With its stable and reliable etching performance, mature automation platform, and exceptionally low cost of ownership, the RAINBOW 4420 serves as an indispensable core dry-etching tool for production lines focused on mature-node and specialty-process technologies using 6-inch or smaller wafers.