ASM AD832i

The ASM AD832i is a four-station, fully automatic die bonder from ASMPT, designed primarily for the packaging of small-scale discrete components such as SOT, SOP, and QFN devices. Equipped with high-precision vision alignment and motion control systems, the machine is capable of reliably picking up micro-dies as small as 0.1 mm, with the tilt angle during pickup—when using original ceramic nozzles—controlled to ≤0.1°. This model is widely used in domestic semiconductor packaging production lines and has also been incorporated into university-level chip packaging training programs, serving as a primary piece of instructional equipment for the die-bonding process.