Used Accretech TSK HRG300A

The Accretech HRG300A is a fully automated wafer grinding system designed for the advanced packaging and manufacturing of 300mm wafers. Unlike conventional thinning equipment, it features specialized enhancements for handling ultra-thin wafers and integrating complex process flows.

Key Features

Specialized for Ultra-Thin Wafers: Optimized for the extremely thin wafers (below 50μm) required in 3D stacking and advanced packaging, the system utilizes refined vacuum chucks and transport mechanisms. This design ensures high rigidity while significantly reducing wafer warpage and breakage rates during grinding and handling.

Flexible Process Head Configuration: Available in single- or dual-spindle configurations, the system incorporates high-precision in-line thickness measurement and non-contact sensors. This enables precise control over the grinding endpoint, ensuring excellent Total Thickness Variation (TTV) uniformity.

Comprehensive Automation: The system comes standard with FOUP handling and automated cleaning capabilities. It offers deep integration with factory automation systems (via SECS/GEM) and includes features for predicting grinding wheel lifespan and managing consumables.

Market Positioning

With its superior yield control for ultra-thin wafers and intelligent production-line integration capabilities, the HRG300A is designed for the high-volume thinning of high-value-added devices, such as HBM (High Bandwidth Memory) and CIS (CMOS Image Sensors).