ASM AD830 Plus

The ASM AD830 Plus is a fully automatic, high-speed die bonder from ASMPT, designed for applications in LED, optoelectronics, and integrated circuit (IC) packaging. Its core strength lies in the balance between high speed and precision: it achieves an output of up to 22,000 units per hour with a placement accuracy of ±25.4 μm, and it accommodates die sizes ranging from 0.15×0.15 mm to 5.08×5.08 mm. The system features a patented linear-motor-driven bonding head and a rotary bonding arm, integrated with an advanced image recognition system that supports both pre- and post-bonding inspection, making it well-suited for high-volume production environments.