Used ASM SONORA®

ASM SONORA® is a high-throughput vertical furnace system for 300mm wafers, designed for advanced logic/foundry, memory, and 300mm analog/power device applications. It supports both atmospheric and low-pressure thermal processing.

Core Positioning: High-Throughput Dual-Chamber Platform

Featuring a dual-chamber, dual-slot architecture, SONORA achieves nearly 100% chamber utilization within a compact footprint, capable of processing up to 150 wafers per batch. Compared to its predecessor, the A412, it delivers up to 30% higher throughput while reducing energy and chemical consumption per wafer.

Process Coverage and Compatibility

The system supports atmospheric processes—such as diffusion, dopant activation, annealing, and oxidation—as well as low-pressure chemical vapor deposition (LPCVD) for polysilicon, silicon nitride, and TEOS. It also covers batch atomic layer deposition (ALD) processes for metal oxides and nitrides. A key advantage is its full compatibility with A412 process recipes (with over 1,000 A412 chambers delivered globally), which facilitates rapid recipe migration and shortens validation cycles during production line upgrades.

Key Design Features: An innovative gas injection system, optimized for low-pressure processes, ensures excellent film uniformity across wafers even at high-throughput loading levels. The modular process chambers feature independently controlled, high-purity microenvironments, maximizing space efficiency while maintaining ease of maintenance.

In summary: With its high-throughput dual-chamber design, compatibility with A412 recipes, and comprehensive coverage of advanced 300mm nodes and specialized processes, SONORA has become ASM’s primary platform for high-volume manufacturing in the vertical furnace segment.