Used TBP CT1500 Inspection & Review System

The TBP CT1500 is a fully automated optical microscopic defect inspection and review system, a standard M&I (Metrology and Inspection) device used in semiconductor front-end and advanced packaging production lines.

Core Positioning: High-Precision Defect Detection and Review

In semiconductor manufacturing, process contamination and physical defects (such as particles, scratches, and photoresist residue) are fatal killers of yield. The core function of the TBP CT1500 is to act as an "optical sentinel" on the production line, performing high-resolution automated scanning of the wafer surface. After detecting defects, it uses a high-magnification optical system for precise coordinate positioning and review, assisting engineers in quickly determining the nature and source of the defects.

Key Technical Features

Multi-mode optical imaging: Combining high-contrast optical illumination technologies such as brightfield and darkfield, it can capture microscopic defects of different materials and morphologies, improving the detection rate.

Fully Automated Transfer and Precise Positioning: Equipped with a standard fully automated wafer transfer system (compatible with FOUP or open wafer cassettes) and a high-precision motion platform, enabling rapid full-wafer scanning and precise defect coordinate backtracking.

Automated Production Line Data Integration: Supports SECS/GEM communication protocols. Defect maps and re-inspection images generated during inspection can be uploaded to the factory's yield management system (YMS) in real time, assisting in closed-loop traceability of process issues.

Summary: With its multi-mode optical inspection, fully automated high-throughput transfer, and precise re-inspection positioning capabilities, the TBP CT1500 has become a core M&I device in semiconductor production lines for monitoring process contamination and ensuring product yield.