Used TEL UNITY II 85DP Plasma Etch equipment

The TEL UNITY II 85DP is a plasma etching system designed for 200mm (8-inch) wafers, belonging to TEL’s classic UNITY II platform. Introduced in 1995, this platform is renowned for its high reliability, with over 800 units delivered globally.

Core Positioning: A Reliable High-Volume Production Platform for Mature Nodes

The UNITY II served as TEL’s primary etching architecture during the 200mm era. The "85DP" designation refers to a specific chamber configuration within this series (where "DP" typically denotes a dual-plasma source or a specialized process chamber). It is primarily utilized for mature process nodes—130nm and above—and is suitable for etching oxides, dielectrics, and polysilicon.

Key Technical Features

Dual-Chamber Architecture: The UNITY II platform can be configured with up to two (optionally three) process chambers, enabling parallel processing that balances throughput with operational flexibility.

Versatile Plasma Sources: The platform supports various chamber configurations, including DRM (Dipole-Ring Magnet—a type of MERIE) and SCCM (Super Capacitively Coupled Module), allowing it to be tailored for specific applications such as dielectric etching or deep silicon trench etching.

Proven Automation and Temperature Control: Standard features include ceramic electrostatic chucks (ESCs) with helium backside cooling, an optical wafer alignment system, and a touchscreen-based control interface, all of which ensure stability in high-volume production.

Summary

The UNITY II 85DP is a mature, field-proven system from TEL for 200mm etching applications. With its robust platform architecture and flexible chamber configurations, it effectively addresses dry etching requirements for both mature process nodes and specialized manufacturing lines.