Used TEL Etching Machine UNITY™ Me+

TEL UNITY™ Me+ is a dry plasma etching platform designed for 100mm to 200mm wafers. As the successor to the UNITY Me (updated in 2021), it is engineered for high cost-effectiveness and long-term reliability.

Core Positioning: A Primary Etching Solution for Power Devices and Compound Semiconductors

This platform offers exceptional cost-efficiency for high-volume manufacturing lines utilizing 200mm or smaller wafers. With the recent rise of SiC power devices, the UNITY Me+ has earned high acclaim for its performance in Si/SiC trench etching, establishing itself as a key tool in this market segment.

Key Technical Features

Flexible Chamber Configuration: The platform can be equipped with DRM or SCCM chambers for SiO₂/SiN processing, or specialized UD chambers for Si/SiC trench etching. A single unit can accommodate up to four chambers, allowing for flexible capacity scaling.

Broad Material Compatibility: Beyond silicon wafers, the system has a proven track record in processing a wide range of compound semiconductor and other materials, including SiC, glass, sapphire, lithium niobate (LN), and lithium tantalate (LT).

Summary

With its flexible chamber configurations and extensive compatibility with compound semiconductors, the UNITY™ Me+ serves as a highly cost-effective, high-volume production platform. It is ideally suited for oxide and nitride film etching, as well as trench processing, for power devices (particularly SiC) and specialized process applications on wafers 200mm in diameter or smaller.