PVA TePla GIGAfab Gen2 High-Capacity Batch Vacuum Plasma Processing System

The PVA TePla GIGAfab Gen2 is a high-capacity, batch-type vacuum plasma processing system designed for large-scale mass production in the fields of advanced semiconductor packaging, wafer-level packaging, and microelectronics.

Core Focus: High Throughput and Exceptional Uniformity

As the second-generation model in the GIGAfab series, the Gen2 is optimized for the high-throughput requirements of large-format wafers and lead frames (strips). Its primary strengths lie in its extra-large chamber and superior plasma uniformity, enabling the processing of a high volume of substrates in a single cycle while ensuring consistent results both within and across batches.

Key Technical Features

Optimized Plasma Source and Chamber Design: Featuring advanced microwave or RF plasma sources and a precision gas distribution system, the Gen2 ensures highly uniform surface activation and decontamination—even when processing large-diameter wafers (e.g., 300mm) or long lead frame strips.

Versatile Process Capabilities: Compatible with a wide range of gases—including O₂, Ar, H₂, N₂, and fluorine-containing gases—the system supports both downstream plasma modes (for gentle treatment of sensitive components) and direct plasma modes. It is ideal for removing organic contaminants and photoresist residues, as well as for enhancing surface energy.

Fully Automated Integration: Equipped with automated FOUP/cassette loading and unloading, along with comprehensive factory automation interfaces (SECS/GEM), the system integrates seamlessly into high-standard mass production lines.

Summary

With its massive processing capacity, highly uniform plasma source, and advanced automation capabilities, the GIGAfab Gen2 serves as a core dry-cleaning solution for mass production lines in advanced packaging (such as pre-bonding cleaning and pre-encapsulation activation) and MEMS manufacturing.