Used Accretech W-GM-6200 for sale

The Accretech W-GM-6200 is a fully automated, dual-spindle wafer grinding machine. As the flagship model in the W-GM series, it is designed for extreme wafer thinning—down to 300mm-diameter wafers—and high-end advanced packaging applications.

Core Focus: Extreme Wafer Thinning

With the advancement of 3D stacking, HBM (High Bandwidth Memory), and Chiplet technologies, the required thickness for thinned wafers is approaching 50μm or even less. The W-GM-6200 is specifically optimized to address the challenges of processing such ultra-thin, fragile wafers; it prioritizes high processing yield and surface integrity while maintaining high throughput.

Key Technical Features

Ultra-thin Wafer Handling and Stress Control: The system features an optimized interface design for vacuum chucks and robotic arms. Combined with stress-relief control during the grinding process, it significantly reduces wafer warpage and breakage rates during high-speed grinding and transport.

Ultra-high Precision Grinding and Metrology: A dual-spindle architecture (coarse and fine grinding) paired with a high-resolution in-line thickness measurement system enables nanometer-level feed control. This ensures excellent TTV (Total Thickness Variation) across the entire wafer and minimizes sub-surface damage.

Intelligence and Full Automation: The machine comes standard with FOUP (Front Opening Unified Pod) handling and cleaning units, and supports SECS/GEM communication. An integrated advanced process data traceability system allows for predictive maintenance of grinding wheel consumables, ensuring the efficient operation of 300mm automated production lines.

Broad Material Compatibility: Beyond silicon-based chips, the system efficiently processes compound semiconductors—such as SiC and GaN—as well as other hard and brittle materials. It also supports the TAIKO thinning process.

Summary

With its exceptional precision control and superior ultra-thin wafer handling capabilities, the W-GM-6200 showcases Accretech’s core expertise in the 300mm high-end grinding sector. It serves as a reliable solution for achieving high-quality, extreme-thinning results in advanced packaging production lines.