DISCO Wafer Dicing Saw NCS Sensor DBCHPFP0002-0

The DBCHPFP0002-0 is a non-contact height-sensing (NCS) sensor used on DISCO wafer dicing machines. It is designed to precisely measure the distance between the tip of the dicing blade and the surface of the work table prior to the cutting process. Working in conjunction with an amplifier, it ensures consistent dicing depth and high-quality cutting results. The sensor features a black, dome-shaped housing with a long lead wire and serves as a critical detection component within the dicing machine’s height-sensing system.