DISCO Wafer Dicing Saw Optical Sensor DBCHPFP3001-01

The DBCHPFP3001-01 is an optical sensor for DISCO wafer dicing saws, serving as a component within either a Non-Contact Height Sensing (NCS) system or a Blade Breakage Detection (BBD) system.

Core Function

In the spare parts catalog, this item is classified as an "optical sensor," grouped alongside blade breakage sensors and non-contact height sensors. It is responsible for capturing optical signals used to monitor the condition of the dicing blade or to detect the height of the blade tip during the dicing process—a critical sensing component for ensuring cutting precision.