Used Lam Research ALLIANCE 9400DSiE Plasma Etch System

The Lam Research ALLIANCE 9400DSiE is a fully automated, high-density plasma etching system designed for 200mm (8-inch) wafers. It is part of Lam’s classic 9400 series platform and is integrated into the Alliance multi-chamber architecture.

Core Focus: Silicon-based and Deep Silicon Etching

This system specializes in the dry etching of silicon (Si) and dielectric materials, with a particular emphasis on Deep Reactive Ion Etching (DRIE) capabilities. It is primarily used in processes such as MEMS manufacturing (e.g., sensors and actuators), power semiconductors, optoelectronics, and the creation of Through-Silicon Vias (TSV) for advanced packaging.

Key Technical Features

High-Density Plasma Source: Utilizing an Inductively Coupled Plasma (ICP) source, the system generates a high-density, highly reactive plasma at lower pressures, enabling high etch rates and excellent control over anisotropy.

Precision Process Control and Endpoint Detection: Equipped with an advanced Optical Emission Spectroscopy (OES) endpoint detection system, it allows for precise determination of the etch endpoint—protecting underlying structures—while facilitating profile control for high-aspect-ratio etching.

Multi-Chamber Integration and High Throughput: Based on the Alliance platform, the system can be configured with multiple process chambers working in tandem. Wafers are automatically transferred within a vacuum environment, which minimizes contamination and increases throughput. It also supports SECS/GEM communication protocols for integration into high-volume production lines.

Summary

With its high-density plasma etching capabilities and expertise in deep silicon etching, the ALLIANCE 9400DSiE serves as a core piece of equipment for high-precision silicon etching in production lines for 200mm MEMS, power devices, and advanced packaging.