Used TEL NS300Z for sale

The TEL (Tokyo Electron) NS300Z is a fully automated, single-wafer cleaning system designed for 300mm wafers, engineered for precision cleaning in advanced logic, memory, and advanced packaging manufacturing processes.

Core Focus: High-Efficiency Single-Wafer Cleaning

Unlike batch-type (tank) cleaning, the NS300Z utilizes a single-wafer, rotating-substrate processing mode. Wafers are placed on a rotating chuck and subjected to sequential chemical dispensing, deionized water rinsing, and drying. This single-wafer approach effectively prevents cross-contamination and allows for precise control over chemical contact time and fluid dynamics—making it ideal for processes that demand exceptionally high particle removal rates and superior surface integrity.

Key Process and Technical Features

Synergistic Chemical and Megasonic Cleaning: The system typically integrates multiple chemical supply lines (e.g., SC1, diluted HF, O₃-enriched water, etc.) and offers an optional megasonic nozzle. This combination leverages both physical and chemical forces to dislodge fine particles while protecting delicate patterns from collapse or mechanical damage.

Full Automation Integration: Equipped with FOUP (Front Opening Unified Pod) handling and factory automation interfaces (SECS/GEM), the system is designed for high-throughput mass production. It supports comprehensive recipe management, in-line particle monitoring, and process data traceability.

Summary

By offering the flexibility and high cleanliness levels inherent to single-wafer processing, the NS300Z is essential for critical cleaning steps—such as those following CMP (Chemical Mechanical Planarization) or etching, and those preceding wafer bonding. It serves as a core piece of equipment for enhancing yield and process stability in 300mm wafer production lines.