Used ASM iHawk Xtreme

The ASM iHawk Xtreme is a fully automatic thermosonic gold-wire ball bonder designed specifically for wire bonding in large-scale, ultra-deep-cavity applications—such as those found in MEMS, sensors, and high-reliability devices—where conventional wire bonders often struggle.

Key Specifications

The system offers a bonding accuracy of 3.0 μm (3σ), a bonding speed of approximately 20 wires per second (at a 2 mm wire length), a maximum wire length of 8 mm, a bonding area of 56 mm × 70 mm, and an XY resolution of 100 nm. It supports wire diameters ranging from 18 to 75 μm, with an adjustable bonding force of 10–150 grams.

Key Features

A standout capability is its 90° vertical deep-cavity bonding, supported by a height-adjustable platform (accommodating substrates up to 12×12 inches). This enables ball bonding for sensitive components—such as those based on gallium arsenide (GaAs)—as well as for exceptionally tall modules. The system utilizes dual-force control, allowing for seamless transitions between different bonding heights, and includes built-in ESD protection and automatic fault diagnosis for "no-ball" (missed-ball) conditions. An "unlimited" Y/Z-axis design further enhances its adaptability for extra-large and ultra-tall devices.

Applications

This model is primarily used in the back-end packaging of MEMS sensors/actuators, hybrid circuits, and secondary integration. It is ideally suited for R&D and small-to-medium-batch production environments that require high-precision bonding on small pads within deep-cavity structures.