Used PVA TePla GIGAbatch 360M

The PVA TePla GIGAbatch 360M is a batch-type microwave plasma ashing and surface treatment system, part of PVA TePla’s compact platform series designed for R&D and small-scale production.

Core Positioning

Engineered for low-volume production requirements, the system utilizes a 2.45 GHz microwave plasma source, primarily for photoresist removal (ashing), surface cleaning, and surface activation. With a chamber capacity of up to 50 wafers (150mm/6-inch), it is well-suited for small-scale manufacturing and process validation in fields such as compound semiconductors, MEMS, and specialty process technologies.

Key Technical Features

Microwave Plasma and Low-Damage Processing: A 2.45 GHz, 1000W microwave source generates high-density plasma via a parabolic antenna. When combined with an optional Faraday cage, it effectively minimizes ion bombardment and thermal damage to the wafers.

Batch Processing Capability: Featuring a quartz chamber (245mm in diameter and 395mm in depth), the system can process up to 50 wafers (6-inch) in a single run, balancing R&D flexibility with the efficiency required for small-batch production.

Process Monitoring and Expandability: The system comes standard with infrared sensors for real-time wafer temperature monitoring and an optical endpoint detection system. Optional features—such as active pressure control (DSC), additional gas lines, and a ceramic chamber—are available to accommodate specialized processes, including those involving fluorine-based gases.

Summary

With its compact, floor-standing design, low-damage microwave plasma technology, and batch-processing capacity, the GIGAbatch 360M serves as a practical solution for ashing, cleaning, and surface activation in R&D laboratories and small-scale specialty production lines.