Used DISCO DGP8761

The DISCO DGP8761 is a fully automated integrated grinding and polishing machine, part of DISCO’s high-end, high-volume production platform designed for 300mm wafers. Unlike dedicated grinding machines (such as the DFG series), the DGP8761 combines both backside grinding and dry polishing into a single system.

Core Functionality: One-Stop Grinding and Polishing

In traditional processes, wafers thinned via grinding must be transferred to a separate polishing machine to remove the microscopic damage layer induced by the grinding process. By integrating these steps, the DGP8761 enables a continuous workflow—from coarse grinding and fine grinding to dry polishing—within one unit. This eliminates the need for intermediate wafer handling, significantly reducing the risk of breakage for ultra-thin wafers (used in applications like 3D NAND, HBM, and CMOS image sensors) while simultaneously increasing overall throughput.

Key Features

Dual Grinding Spindles + Polishing Spindle: Typically equipped with dual grinding spindles for efficient material removal, along with a dedicated polishing unit that utilizes chemical-mechanical or dry polishing techniques to eliminate subsurface damage and enhance surface flatness.

Full Automation: Features standard FOUP-based wafer transport, fully automated loading/unloading, an integrated cleaning unit, and support for SECS/GEM communication, allowing for seamless integration into 300mm automated production lines.

Ultra-Thin Wafer Handling: Optimized handling mechanisms for extremely thin wafers; supports the TAIKO grinding process and is capable of effectively processing wafers to thicknesses below 50μm.

Summary

The DGP8761 serves as DISCO’s flagship integrated grinding and polishing system for 300mm advanced packaging and wafer manufacturing—ideally suited for high-volume production environments that demand exceptional surface quality and high grinding efficiency.