HYBOND Wire Bonder 522A for sale

The HYBOND 522A is a manual thermosonic ball bonder. Unlike the 572A wedge bonder you previously inquired about, this model utilizes gold ball bonding. Its primary advantages are intuitive operation and ease of maintenance, making it well-suited for R&D and small-batch production environments.

Core Technology: It features HYBOND’s proprietary Soft-Touch™ force-control system, which employs a force-ramping approach during contact with the bonding surface to minimize impact damage to sensitive materials such as GaAs and InP. It supports a 1-2-2 stitch bonding mode, accommodates gold wires ranging from 0.7 to 2.0 mils, offers a bonding force range of 15–150g, and provides temperature control from room temperature up to 250°C.

Operation and Specifications: The front panel provides centralized control for ultrasonic power, time, force, tail length, and EFO (Electronic Flame-Off) power, while the Z-axis is operated manually via a dedicated lever. The system includes a 6×8.5-inch work stage equipped with a 4:1 manual X-Y manipulator. It features a vertical bonding window of 60–100 mils, making it suitable for applications involving standard height variations.

In short, the 522A serves as the entry-level manual production model within HYBOND’s ball-bonding product line, complementing the 572A wedge bonder and the 616B pin bonder by addressing a distinct bonding application.