Used TEL NS300+ 200mm Conversion

This is not an official, standalone model; rather, it refers to an NS300+ single-wafer cleaning system—originally designed for 300mm wafers—that has been modified or configured specifically to process 200mm wafers.

Model Overview

This is a fully automated single-wafer wet cleaning platform. Based on the architecture of TEL’s NS300+ (a system designed for 300mm high-volume manufacturing), it has been adapted for 200mm wafers through the installation of 200mm-specific chucks and robotic end-effectors, alongside adjustments to transport tracks and software recipes. It is typically deployed in R&D lines, pilot production lines, or facilities dedicated to specialized processes, such as those for silicon carbide (SiC).

Key Features

High-Purity Single-Wafer Cleaning: Utilizes a single-wafer, rotating-process approach to eliminate cross-contamination—a common issue in batch processing—while enabling precise control over chemical reaction times to meet stringent low-defect requirements.

Optimized Fluid Control: Features a precision-engineered chamber airflow and drainage path, combined with an advanced drying process, to effectively prevent watermarks and the re-adhesion of particles.

Versatile Chemical Compatibility: Supports a wide range of cleaning agents, including SC1, diluted HF, and ozonated water (O₃ water), addressing cleaning requirements for post-CMP, post-etch, and other process steps.

High Level of Automation: Comes standard with FOUP (Front Opening Unified Pod) loading/unloading capabilities and SECS/GEM communication, ensuring high throughput and seamless integration into production lines.

Summary: This configuration represents an adaptation of the NS300+ platform for 200mm production lines, effectively combining the mature, proven technology of the 300mm platform with the specific processing requirements of 200mm wafers.