Used DISCO DFG8560

The DISCO DFG8560 is a fully automated, dual-spindle wafer grinding system—a flagship, high-volume production tool designed for the back-grinding (thinning) of 300mm wafers.

Core Positioning: Exceptional Throughput and Precision

As an advanced successor to the DFG8540, the DFG8560 elevates high-efficiency dual-spindle grinding and ultra-precise thickness control to new levels. It is engineered to meet the extreme thinning requirements of advanced logic chips, High-Bandwidth Memory (HBM), and large-format power devices (such as IGBTs).

Key Technologies and Features

Dual-Spindle Synergy and High Precision: Equipped with two high-rigidity spindles, the system enables continuous rough and fine grinding in a single pass. Integrated with a high-precision in-line thickness gauge, it not only significantly boosts throughput but also ensures superior Total Thickness Variation (TTV) and surface roughness, meeting the stringent demands for ultra-thin wafers.

Full Automation and Low Breakage Rate: The system comes standard with FOUP handling, fully automated loading/unloading, and an integrated cleaning unit. Its optimized transport mechanism minimizes the risk of wafer breakage—even when handling ultra-thin wafers (e.g., below 50μm).

Broad Process Compatibility: The system supports a wide range of materials, including silicon, compound semiconductors (SiC, GaN), and hard, brittle materials like sapphire. It also offers an optional TAIKO grinding process to effectively manage edge-stress issues.

Summary

The DFG8560 represents the pinnacle of DISCO’s technology for 300mm wafer grinding. With its high throughput, exceptional precision, and robust stability, it serves as an indispensable core asset for advanced packaging and wafer manufacturing production lines.