Used KAIJO FB-e20N

The KAIJO FB-e20N is a fully automatic thermosonic ball bonder designed for discrete devices, LEDs, and small-form-factor packages. It is engineered to deliver sub-micron bonding precision and process stability while maintaining high throughput.

Core Specifications

The system achieves a bonding precision of 3σ ≤ 2.0 μm across a 56 mm × 80 mm bonding area. With a bonding speed of just 43 milliseconds per wire, it is well-suited for high-volume production environments. It supports gold, copper, and silver-alloy wires, and is compatible with both lead frames and strip-based carriers.

Key Technical Features

The FB-e20N incorporates KAIJO’s next-generation "α eyes" recognition algorithm, which significantly mitigates the impact of external disturbances on image recognition, thereby enhancing alignment stability for ultra-small bond pads. The ultrasonic system utilizes a dual-frequency transducer—allowing for the selection of two distinct frequencies for each wire—complemented by an advanced current/voltage control mode that broadens the machine's adaptability to various wire materials and package types. Furthermore, the "Step Bond Sequence" function provides a visualization of the bonding process, enabling engineers to fine-tune parameters for miniature packages with high precision.

Production Line Integration

The equipment comes standard with the SECS/GEM communication protocol, facilitating seamless integration with factory host management systems for quality traceability and real-time equipment status monitoring. Features such as automatic wire threading, automated capillary cleaning, and an optional barcode reader further minimize downtime required for routine maintenance.