Used ASM AD862M Die Bonder

The AD862M is a die bonder from ASMPT, part of its AD series of die-bonding platforms designed for high-volume production in advanced packaging lines. As a die bonder, its primary function is the high-precision placement of bare dies onto substrates or wafers; it is not used for testing or thin-film deposition.

Process Application: It is utilized for flip-chip bonding, die stacking in 2.5D/3D packaging, and die placement for fan-out packaging. Its core purpose is to ensure high-precision alignment and stable bonding between the die and the substrate, falling under the category of back-end packaging processes. Within ASMPT’s product portfolio, the AD series corresponds to specific tiers of placement precision and automation; the AD862M is one of the models tailored for high-volume packaging production.

Design Focus: The system emphasizes high-precision visual alignment and bonding stability. It is equipped with precision motion control and vision systems, supports flexible switching between various packaging recipes, and balances high-volume throughput with high placement yield. The "M" in the model name typically denotes a specific configuration or process optimization—often relating to alignment accuracy, throughput capacity, or support for particular packaging formats.

Classification: As a die-bonding tool, it belongs to the back-end packaging segment, distinct from processes like thin-film deposition or electroplating. Along with ASMPT’s PHOTON and MEGA series, as well as Canon’s BESTEM series, it addresses the precision requirements for die placement in advanced packaging. In short, the AD862M is one of ASMPT’s high-volume production models designed for the die-bonding stage of advanced packaging.