Used Ebara F-REX300X Fully Automated Chemical Mechanical Polishing (CMP) System

The Ebara F-REX300X is a fully automated chemical mechanical polishing (CMP) system designed for 300mm (12-inch) wafers. It serves as the flagship model for high-volume manufacturing on Ebara’s F-REX platform.

Core Positioning: A Key Enabler for Planarization in Advanced Process Nodes

Engineered specifically for 300mm wafers, this system is primarily used for global planarization processes in advanced logic, memory (such as 3D NAND and DRAM), and high-performance power devices. It is capable of polishing dielectric layers (SiO₂, low-k materials), metal layers (copper, tungsten), and barrier layers, meeting the stringent requirements for superior flatness and ultra-low defect rates demanded by advanced process nodes.

Key Technical Features

Multi-Platen Architecture and High Throughput: The system utilizes a multi-platen architecture, allowing for flexible configuration of rough and fine polishing processes. Compared to 200mm-class systems, this large-format platform significantly boosts wafer throughput while optimizing within-wafer non-uniformity (WIWNU) for 300mm wafers.

Precision Polishing Head Control: Equipped with polishing heads featuring independent zonal pressure control, the system can dynamically adjust downward pressure across different regions of the 300mm wafer surface. This effectively mitigates edge effects and controls phenomena such as dishing and erosion.

In-line Cleaning and Endpoint Detection: The system integrates an efficient in-line cleaning module, performing brush-cleaning and drying immediately after the polishing process to prevent particle re-adhesion. Furthermore, it incorporates high-precision optical or eddy-current endpoint detection systems, ensuring precise process termination and preventing yield loss caused by over-polishing.

Summary

With its high-throughput multi-platen design, precise localized pressure control, and comprehensive integration of cleaning and endpoint detection, the Ebara F-REX300X stands as a core CMP tool for ensuring high-quality planarization in 300mm advanced manufacturing lines.