Used SEMES LOUTS

SEMES LOUTS is a single-wafer wet processing system designed for 300mm wafers. Its name is derived from "Lotus," symbolizing the achievement of exceptional cleanliness and surface purity within a liquid environment; it is primarily utilized for precision cleaning and surface treatment in advanced semiconductor manufacturing processes.

Core Positioning: High-Cleanliness Single-Wafer Processing

The LOUTS system employs a single-wafer, rotating-substrate architecture. Wafers are held on a chuck and subjected to a sequential process of chemical dispensing, deionized water rinsing, and drying. This single-wafer approach eliminates the risk of cross-contamination—a common drawback of batch (tank-based) cleaning—and allows for millisecond-level precision in controlling chemical reaction times, meeting the stringent, ultra-low defect rate requirements of advanced process nodes.

Key Technical Features

Optimized Chamber Fluid Dynamics: The internal chamber is precision-engineered to manage airflow patterns and drainage paths. Combined with a sophisticated drying process, this effectively prevents the formation of watermarks and the re-adhesion of particles, ensuring superior surface cleanliness.

Flexible Chemical Compatibility: The system supports the precise mixing and delivery of various chemicals—such as SC1, diluted HF, and O₃-infused water—making it adaptable to a wide range of applications, including post-CMP cleaning, post-etch cleaning, and pre-bonding surface preparation.

Fully Automated Integration: Equipped with standard FOUP loading/unloading capabilities and SECS/GEM communication protocols, the system offers high throughput and integrates seamlessly into fully automated 300mm high-volume production lines.

Summary

Through refined fluid control and high operational stability, the LOUTS system provides a single-wafer wet processing solution for 300mm production lines that balances exceptional cleanliness with high productivity. It serves as a critical tool for ensuring high yields in the manufacturing of advanced logic and memory devices, as well as in semiconductor packaging processes.