Used SCREEM FC-3100

The FC-3100 is a next-generation, fully automated, batch-type wet cleaning system (wet station) designed by SCREEN for 300mm wafers. Released in 2005, it serves as the successor to the FC-3000—a system that was the industry benchmark at the time. Unlike the CW-2000 (a compact system for smaller wafer sizes) or the FC-821L (a flexible, single-bath system for 200mm wafers) that you previously inquired about, the FC-3100 is positioned for high-volume, 300mm wafer cleaning in advanced logic semiconductor manufacturing lines.

Core Design: The system features an independent modular architecture, composed of seven standardized modules—each integrating two cleaning baths. This design facilitates rapid assembly, commissioning, and deployment on the production floor, significantly shortening the lead time from order placement to full-scale production. The wafer-handling system has been optimized to achieve a throughput of 460 to 650 wafers per hour (figures vary by source), with later official specifications citing a maximum capacity of up to 1,000 wafers per hour.

Key Process Technologies: The system incorporates a HiLPD (High-efficiency Low-Pressure Drying) system, which supplies high-concentration IPA vapor without the need for an N₂ carrier gas; this effectively suppresses watermarks and prevents the collapse of high-aspect-ratio structures. It also supports a Single-Chamber Cleaning (SCC) module—integrating dilute chemical cleaning and low-pressure drying within a controlled environment—as well as a phosphoric acid concentration feedback system, addressing the requirements for 65nm process nodes and below.

In short, the FC-3100 is SCREEN’s primary high-volume production platform for 300mm batch cleaning, distinguished by its modular flexibility and high throughput. It belongs to an entirely different process segment compared to the single-wafer deposition or electroplating equipment you previously looked into.