DISCO DFG8540 Fully Automatic Dual-Spindle Wafer Grinder for sale

The DISCO DFG8540 is a fully automated, dual-spindle wafer grinding machine designed for the high-efficiency, high-volume backside thinning of 300mm wafers.

Core Positioning: High-Efficiency, High-Volume Production with Dual Spindles

Unlike the single-spindle DFG8340, the DFG8540 is equipped with two grinding spindles. This allows it to perform both "coarse grinding" and "fine grinding" sequentially within a single unit, eliminating the need to transport wafers between different machines. This design not only significantly boosts throughput per tool but also minimizes the risk of wafer breakage during the transfer of ultra-thin wafers.

Key Features

High-Precision Processing: With independently controlled dual spindles and integrated in-line thickness measurement, the system ensures excellent TTV (Total Thickness Variation) and superior surface quality, meeting the stringent requirements for ultra-thin wafers in advanced packaging.

Full Automation: The system comes standard with FOUP handling, fully automated loading/unloading, and an integrated cleaning unit—engineered specifically for high-throughput, high-cleanliness 300mm production lines.

Versatile Process Capabilities: Suitable for silicon, compound semiconductors (SiC, GaN), and hard, brittle materials; it also supports the TAIKO thinning process (optional).

Summary

By combining the high throughput of dual-spindle grinding with the high stability of full automation, the DFG8540 serves as a primary workhorse for high-volume backside thinning in 300mm wafer manufacturing and advanced packaging production lines.