Used KLA M&I Equipment TENCOR P2

The KLA-Tencor P2 is a classic, fully automated stylus profiler from the Tencor product line (part of KLA). It is widely used in semiconductor front-end manufacturing and advanced packaging processes to measure thin-film thickness and surface topography.

Core Function: Surface Topography and Film Thickness Measurement

The system utilizes an ultra-fine diamond stylus that physically traverses the wafer surface to measure step heights, trench depths, surface roughness, and stress. It serves as a fundamental metrology and inspection (M&I) tool for monitoring the stability of processes such as deposition, etching, and chemical mechanical planarization (CMP).

Key Technical Features

High-Precision Stylus Scanning: Equipped with a low-force stylus and a highly sensitive sensor, the system achieves nanometer-level height resolution and excellent repeatability—all while ensuring that delicate films (such as photoresists or low-k dielectrics) remain unscratched.

Fully Automated, High-Throughput Operation: Featuring an integrated automated wafer-handling system, the P2 supports fully autonomous multi-point scanning and 3D topographic mapping. Its programmable measurement paths make it ideal for process control (SPC) in high-volume production environments.

Broad Application Range: The system is suitable for measuring the thickness of metal or dielectric films, the depth of microstructures (such as TSV deep vias), photoresist thickness, and wafer surface roughness.

Summary

With its high-precision contact-based scanning, superior automation capabilities, and long-term stability, the KLA-Tencor P2 stands as a core M&I tool for monitoring thin-film thickness and surface topography in semiconductor production, playing an indispensable role in process control.