Used Accretech HRG300

The Accretech (Tokyo Seimitsu) TSK HRG300 is a fully automated, dual-spindle wafer grinding system designed for high-volume back-grinding (thinning) of 300mm wafers.

Core Positioning and Architecture

As a large-format model within the HRG series, it features a dual-spindle architecture (coarse grinding + fine grinding). Wafers undergo both grinding stages sequentially within a single chamber—eliminating the need for inter-machine transfers—thereby ensuring high throughput while maintaining a low wafer breakage rate. The system’s high-rigidity frame and low-vibration spindles guarantee excellent Total Thickness Variation (TTV) and superior surface quality, even when thinning wafers to ultra-thin dimensions.

Key Features

Full Automation Integration: Equipped with standard FOUP handling and automated loading/unloading, with options for in-line thickness measurement and cleaning units. It supports SECS/GEM communication, allowing for seamless integration into 300mm automated production lines.

Process Compatibility: Suitable for silicon, compound semiconductors (SiC, GaN), and hard, brittle materials. It also supports the TAIKO grinding process (optional), which effectively mitigates edge chipping and stress-related issues.

Production Stability: Includes grinding wheel life monitoring and early-warning functions, facilitating preventive maintenance and ensuring long-term, stable equipment operation.

Summary

The HRG300 is a core grinding tool from Accretech, engineered for 300mm advanced packaging and wafer manufacturing lines. Through its efficient dual-spindle grinding process and robust, fully automated design, it meets the rigorous demands for throughput, precision, and yield in high-volume production environments.