Used TEL ZETA™

The TEL ZETA™+ Semi-auto is a semi-automated, single-wafer cleaning system designed primarily for R&D laboratories, small-batch pilot production, and applications requiring high process flexibility. At its core, it utilizes TEL’s proprietary ZETA™ non-contact megasonic cleaning technology.

Core Positioning: R&D and Flexible Production

Unlike fully automated, high-volume production systems, this unit employs a semi-automated operating mode—typically involving manual wafer loading and unloading—while utilizing the same fundamental cleaning processes found in full-scale production lines. This allows it to meet the stringent, ultra-low defect rate requirements of advanced process nodes, while offering process engineers greater freedom for experimentation and optimization.

Key Technical Features

ZETA™ Non-Contact Cleaning: This technology employs megasonic waves combined with specialized fluids to remove fine particles without physical contact with the wafer surface. This prevents issues such as mechanical scratching (from brushes) or pattern collapse, making it particularly well-suited for delicate structures, including ultra-thin wafers and fine-featured patterns.

Flexible Process Configuration: The system supports the use of various chemical agents (such as SC1 or diluted HF) with precise temperature control, enabling the development and tuning of recipes for diverse applications—including post-CMP cleaning, post-etch cleaning, or pre-bonding surface preparation.

Compact Design and Ease of Maintenance: Compared to fully automated production systems, the ZETA™+ Semi-auto features a smaller footprint, facilitating deployment in laboratory or R&D environments, while still retaining essential auxiliary functions such as particle monitoring.

Summary

The ZETA™+ Semi-auto brings TEL’s advanced megasonic cleaning technology to a semi-automated platform, providing a high-purity, highly flexible solution for R&D validation and small-scale production.