Used TEL 8500 Fully Automated Dry Etching System

The TEL 8500 is a fully automated dry etching system designed for 200mm (8-inch) wafers. As part of TEL’s classic 8500 series platform, it is primarily utilized for high-volume manufacturing (HVM) in mature process nodes and specialty technology applications.

Core Positioning: A Workhorse for Mature Process Etching

This system is primarily used for the anisotropic etching of materials such as silicon, silicon dioxide, silicon nitride, and various metal layers. Leveraging TEL’s extensive expertise in plasma control, the 8500 platform has a large installed base across sectors including power semiconductors (e.g., IGBTs, MOSFETs), analog chips, MEMS, and advanced packaging.

Key Technical Features

Highly Stable Plasma Source: Utilizing proven high-frequency radio frequency (RF) excitation and a precision gas distribution system, the platform ensures uniform plasma density, resulting in stable etch rates and excellent within-wafer non-uniformity (WiWNU).

Precision Endpoint Detection: Equipped with Optical Emission Spectroscopy (OES) or interferometric endpoint detection systems, the tool accurately identifies the etch endpoint, effectively protecting underlying layers and meeting requirements for high-selectivity processes.

High Throughput and Automation: The system comes standard with a fully automated wafer-handling system and supports SECS/GEM communication, allowing for seamless integration into automated production lines. The platform benefits from a mature process ecosystem, with relatively low costs for spare parts and maintenance.

Summary

With its stable and reliable etching performance, superior uniformity control, and low total cost of ownership, the TEL 8500 serves as an indispensable core dry etching tool for 200mm mature process and specialty technology production lines.