Used DISCO DAG811

The DISCO DAG811 is a semi-automatic, single-spindle wafer grinding machine. As an upgraded version of the DAG810, it is primarily designed for back-grinding (thinning) wafers and other hard, brittle materials.

Core Positioning and Enhancements

While maintaining a semi-automatic operational mode—requiring manual loading and unloading of wafers, with automated grinding—the DAG811 offers improvements in processing capacity and production efficiency. It comes standard with support for Φ200mm wafers, with an optional configuration for Φ300mm wafers, providing broader compatibility. Compared to its predecessor, it features optimizations in spindle feed speed and overall cycle time.

Key Specifications and Capabilities

Equipped with a high-rigidity, low-vibration spindle, the machine enables high-precision thickness control. In addition to silicon wafers, it is suitable for processing hard, brittle materials such as compound semiconductors (e.g., SiC, GaN), sapphire, and ceramics; it also supports the TAIKO thinning process (optional). With its compact design and small footprint, the equipment is well-suited for R&D laboratories, small-to-medium-scale production lines, and compound semiconductor manufacturing environments.