Used PVA TePla IoN 200

The PVA TePla IoN 200 is a high-capacity, in-line atmospheric-pressure plasma cleaning system. Positioned as the high-throughput model within the IoN series, it is specifically designed for mass production lines that handle large-format panels or require high-density, high-speed throughput.

Core Positioning: High-Throughput Mass Production

Unlike more compact models, the IoN 200 is optimized for wider workpieces—such as large-format packaging substrates or panel-level packaging (PLP) carriers—and faster transport speeds. It delivers uniform, wide-area plasma treatment at atmospheric pressure, meeting the rigorous demands for processing efficiency and consistency in large-scale automated production lines.

Key Technical Features

Wide-Area Uniform Plasma Zone: Utilizing an array of multiple nozzles combined with a precision gas-flow distribution design, the system creates a stable, uniform plasma zone across a wide transport path. This ensures comprehensive surface treatment for large-format workpieces with no "dead zones" and exceptional consistency between batches.

Precise Process Control: The system supports independent mixing ratios for various process gases (such as Ar, O₂, and N₂) and features pulsed plasma excitation control. Atmospheric-pressure processing eliminates vacuum-induced stress while enabling the gentle, precise removal of organic residues and the enhancement of surface energy.

Seamless Production Line Integration: Equipped with SMEMA interfaces and SECS/GEM communication protocols, the IoN 200 integrates effortlessly with automated handling systems (e.g., robotic arms) and factory Manufacturing Execution Systems (MES). It supports automated recipe switching and real-time data traceability.

Summary

With its wide-area, highly uniform atmospheric-pressure plasma treatment capabilities and high level of integration, the IoN 200 provides an efficient, stable, and non-damaging dry-cleaning and surface-activation solution for mass-production applications, such as panel-level packaging and the assembly of large-format substrates.