Used SPP VPX-PEGASUS Plasma Etching and Surface Treatment System

The SPP VPX-PEGASUS is a fully automated plasma etching and surface treatment system manufactured by SPP Process Technology Systems (now part of the PVA TePla Group). It is primarily used for dry ashing (photoresist removal) and surface modification in semiconductor packaging, microelectronics, and MEMS applications.

Core Positioning: A Dry-Processing Platform for Packaging and Specialty Processes

Designed for back-end packaging and front-end specialty processes, this system utilizes plasma—operating under either atmospheric or vacuum conditions—to efficiently remove photoresist and organic contaminants, or to perform surface activation. It is engineered to handle high volumes of 200mm/300mm wafers, lead frames, and packaging substrates, all while ensuring the protection of sensitive underlying structures.

Key Technical Features

High-Density Plasma Source and Uniformity Control: The system employs optimized plasma generation technology, ensuring a highly uniform plasma distribution across large-area substrates or wafers. This guarantees consistent ashing rates and uniform surface treatment results.

Gentle Processing with Minimal Damage: By utilizing a "downstream" plasma mode, the system filters out high-energy ions, relying solely on reactive radicals for processing. This eliminates ion bombardment and electrostatic damage, making it exceptionally well-suited for wafers featuring delicate patterns or metal layers.

Automated Integration: Equipped with a fully automated loading/unloading system and supporting SECS/GEM communication, the platform integrates seamlessly into high-volume production lines for packaging and specialty processes.

Summary

With its high-uniformity dry ashing capabilities and gentle surface treatment, the VPX-PEGASUS serves as a critical plasma processing tool for maintaining high yields in semiconductor packaging and specialty manufacturing lines.