Used ASM iHAWK Xtleme

The iHawk Xtreme belongs to the same iHawk wire-bonding platform from ASM as the iHawk-V you previously inquired about. However, rather than being designed for "general-purpose mass production," the Xtreme is engineered to handle deep-cavity structures and exceptionally large components. It is specifically tailored for applications—such as MEMS, hybrid circuits, and sensitive GaAs devices—that impose stringent requirements on bonding height and force control.

Key Differentiators: The standout features of the iHawk Xtreme include 90-degree vertical deep-cavity bonding capability and an unrestricted Y/Z-axis travel range, enabling it to perform ball bonding on oversized or ultra-tall modules—capabilities not found in standard mass-production wire bonders. Its dual-force control system (adjustable from 10g to 150g), combined with an ultrasonic power output of approximately 3W, is optimized for sensitive components like GaAs devices, minimizing impact damage during the bonding process.

Speed and Precision: Utilizing a thermosonic bonding method, the system achieves a throughput of 20 wires per second (at a 2mm wire length). It offers a bonding precision of 3.0 µm (@ 3 Sigma), with an XY resolution of 100nm and a Z resolution of 200nm. The bonding area spans 56×70mm, accommodating lead frames with widths of up to 80mm. It supports wire diameters ranging from 18–75 µm, covering the standard specifications for gold-wire ball bonding.

Applications: In technical documentation, the iHawk Xtreme is positioned as a solution for the back-end packaging of MEMS sensors and actuators. It is also well-suited for secondary integration, hybrid circuit bonding, and high-reliability applications in the defense and aerospace sectors. These use cases are characterized by irregular device geometries, significant height variations, and an extremely low tolerance for damage to sensitive materials—distinct from the high-volume, standardized assembly lines used for QFN/BGA packages.

In short, the iHawk Xtreme is a specialized model within the iHawk platform designed for unique packaging requirements and deep-cavity ball bonding. It complements the general-purpose, mass-production-oriented iHawk-V rather than serving as a replacement for it.