ASM AD838L

The ASM AD838L is a fully automatic, high-speed die bonder from ASMPT, primarily used for silver-paste die-attach processes in semiconductor packaging. The system accommodates extra-large substrates up to 300 mm × 100 mm and features a patented bond head design along with a "drag-free" indexing material-handling system. In its high-precision configuration, it achieves an XY placement accuracy of ±15 μm @ 3σ. Documentation from the Zhejiang University Shaoxing Research Institute indicates a placement accuracy of 20 μm, making the system suitable for advanced packaging platforms in the integrated circuit industry. The equipment supports various bonding processes—including eutectic, epoxy, and flip-chip—and offers remote monitoring and diagnostic capabilities.