ACM Research ULTRA C TAHOE Fully Automated Batch-Type Wafer Cleaning Equipment

The ULTRA C TAHOE by ACM Research is a fully automated batch-type wafer cleaning system. Featuring ACM’s proprietary TAHOE technology, it is specifically designed for high-purity cleaning of 300mm wafers in advanced semiconductor manufacturing processes.

Core Process: TAHOE Batch Cleaning Technology

Unlike traditional full-immersion batch cleaning, TAHOE technology combines the advantages of batch immersion with those of single-wafer spin cleaning. Through a specialized hydrodynamic design, the system performs highly efficient cleaning within the process tank, followed by a high-quality drying process modeled after single-wafer drying mechanisms. This approach not only enables high throughput for large-volume processing but also effectively mitigates issues common in conventional batch cleaning—such as particle re-adhesion and cross-contamination—thereby ensuring an extremely low defect rate.

Integration and Compatibility

As a batch-processing tool, the system supports high-capacity, continuous production and is well-suited for processes requiring exceptional cleaning uniformity (e.g., cleaning, etching, and photoresist removal). It comes standard with FOUP (Front Opening Unified Pod) loading/unloading capabilities and supports SECS/GEM communication, allowing for seamless integration into automated 300mm high-volume production lines.

Summary

The ULTRA C TAHOE merges the high throughput of batch-type equipment with the superior cleaning quality of single-wafer systems, offering a cost-effective cleaning solution for 300mm production lines that balances high efficiency with an ultra-low defect rate.