TSK Wafer Cleanner C-RW Series for sale

The TSK (Accretech) C-RW series is a fully automated wafer cleaning system designed for the efficient removal of particles, metal ions, and organic residues during semiconductor front-end processing and advanced packaging.

Core Cleaning Mechanisms

This series utilizes a synergistic approach combining physical and chemical cleaning. It typically integrates high-pressure deionized water spraying, two-fluid (N2 + water) cleaning, or megasonic technology—often supplemented by brushes or rollers—to effectively dislodge fine particles and contaminants from the wafer surface. To address specific process requirements (such as post-grinding, post-CMP, or pre-lamination), the system offers flexible, optional modules for the delivery of chemical agents (e.g., SC1 or diluted HF), enabling precise control over cleaning and etching processes.

Automation and Compatibility

The C-RW series features fully automated, recipe-based control and supports both 200mm and 300mm wafers. It comes standard with an automated loading/unloading system compatible with FOUPs or open wafer cassettes. The equipment incorporates designs to prevent cross-contamination and offers optional in-line modules for particle detection and film thickness measurement. Furthermore, it supports SECS/GEM communication, allowing for seamless integration into automated high-volume production lines.

Summary

With its robust cleaning performance and high level of automation, the C-RW series serves as a critical tool for removing particulate contamination—whether post-grinding, pre-bonding, or during packaging—thereby enhancing product yield.