Used ACM Research ULTRA C S II

The ULTRA C S II from ACM Research is a fully automated single-wafer cleaning system designed for the precision cleaning of 300mm wafers in advanced semiconductor manufacturing and advanced packaging processes.

Core Technology: Space-Alternated Phase-Shift (SAPS) Megasonics

The system’s primary innovation is its proprietary SAPS (Space-Alternated Phase-Shift) megasonic technology. By utilizing a specialized waveform to drive megasonic waves, the system generates a uniform flow of microbubbles across the wafer surface, enabling the efficient removal of fine particles and residues without damaging delicate patterns. This capability is critical for processes involving ultra-fine line widths and fragile structures, such as high-aspect-ratio features found in 3D NAND and DRAM.

Integration and Compatibility

The system employs a single-wafer rotating process and integrates multiple chemical supply lines (e.g., SC1, diluted HF) along with a nitrogen-based drying module. It comes standard with FOUP loading/unloading capabilities and supports SECS/GEM communication, allowing for seamless integration into automated 300mm high-volume production lines. Furthermore, the platform offers high process flexibility; it is suitable not only for front-end-of-line (FEOL) cleaning but also for various advanced packaging applications, such as TSV (Through-Silicon Via) exposure and post-CMP (Chemical Mechanical Planarization) cleaning.

Summary

By leveraging its unique, uniform megasonic cleaning technology, the ULTRA C S II delivers a highly stable cleaning solution for 300mm production lines while ensuring an exceptionally low defect rate.