Used ACM Research ULTRA C SAPS V

The ACM Research ULTRA C SAPS V is a fully automated single-wafer cleaning system equipped with the company’s proprietary Space-Alternated Phase-Shift (SAPS) megasonic technology. It is specifically designed for the precision cleaning of 300mm wafers used in advanced semiconductor manufacturing and advanced packaging.

Core Process: SAPS Megasonic Technology

The system’s primary innovation is its SAPS technology. By driving megasonic waves with a specialized waveform, the system generates a uniform flow of microbubbles across the wafer surface, creating a powerful physical cleaning force. This mechanism effectively removes fine particles and residues without damaging delicate patterns—such as high-aspect-ratio structures—making it critical for improving yields in 3D NAND, DRAM, and logic chip production.

Integration and Compatibility

The system utilizes a single-wafer, rotating-process architecture and integrates multiple chemical supply lines (e.g., SC1, diluted HF) alongside a drying module. It comes standard with FOUP (Front-Opening Unified Pod) loading/unloading capabilities and supports SECS/GEM communication, allowing for seamless integration into automated 300mm high-volume production lines. The platform is suitable not only for front-end-of-line (FEOL) cleaning but also for various advanced packaging applications, such as TSV (Through-Silicon Via) exposure and post-CMP (Chemical Mechanical Planarization) cleaning.

Summary

Leveraging its unique, uniform megasonic cleaning technology, the ULTRA C SAPS V provides a highly stable cleaning solution for 300mm production lines while ensuring an exceptionally low defect rate.