Used SEMES BLUEICE PRIME Fully Automated Single-Wafer Cleaning System

Short Description:

The SEMES BLUEICE PRIME is a fully automated single-wafer cleaning system.

Product Detail

SEMES  Research Wafer BLUEICE PRIMEThe SEMES BLUEICE PRIME is a fully automated single-wafer cleaning system designed for the high-precision cleaning of 300mm wafers used in advanced logic, memory, and advanced packaging processes.

Core Positioning: High-Performance Single-Wafer Cleaning

The system utilizes a single-wafer, rotating-process architecture, where each wafer is held on a chuck and subjected to sequential chemical dispensing, deionized water rinsing, and drying. This single-wafer approach eliminates the risk of cross-contamination inherent in batch processing and allows for precise control over chemical reaction times—meeting the stringent requirements for ultra-low defect rates and high surface integrity at advanced technology nodes.

Key Technical Features

Optimized Fluid and Drying Control: The process chamber is engineered with an optimized airflow and drainage structure. Combined with refined rinsing and drying protocols, this effectively suppresses the formation of watermarks and prevents particle re-adhesion, ensuring an exceptionally clean wafer surface.

Flexible Chemical Delivery: The system supports the precise mixing and delivery of various chemicals (such as SC1, diluted HF, and O₃-infused water). When paired with megasonic-assisted cleaning, it efficiently addresses diverse requirements, including post-CMP, post-etch, and pre-bonding cleaning steps.

High-Throughput Automation: Equipped with standard FOUP loading/unloading interfaces and high-speed transfer robotics, the system supports SECS/GEM communication protocols. Its high throughput enables seamless integration into fully automated 300mm high-volume manufacturing lines.

Summary

With its sophisticated fluid control, high operational stability, and high-throughput automation, the BLUEICE PRIME serves as a critical tool for ensuring cleaning consistency and improving yields in 300mm advanced semiconductor manufacturing lines.

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