Used TEL CELLESTA™ -i

The TEL CELLESTA™ -i is a fully automated, single-wafer cleaning system for 300mm wafers, engineered for high-precision cleaning in advanced logic and memory manufacturing processes.

Core Focus: High-Efficiency Single-Wafer Cleaning

Utilizing a single-wafer rotating architecture, the system processes each wafer on a chuck through sequential stages of chemical dispensing, deionized water rinsing, and drying. This single-wafer approach eliminates the risk of cross-contamination inherent in batch processing and allows for precise control over chemical reaction times—meeting the stringent, ultra-low defect rate requirements of advanced technology nodes.

Key Technical Features

Optimized Fluid and Drying Control: The process chamber is precision-engineered to manage airflow and drainage paths. Combined with sophisticated rinsing and drying protocols, this effectively prevents the formation of watermarks and the re-deposition of particles.

Flexible Multi-Chemical Delivery: The system supports the mixing and delivery of various chemicals—such as SC1, diluted HF, and O₃-infused water—to efficiently address diverse cleaning requirements, including post-CMP, post-etch, and pre-bonding applications.

High-Throughput Automation: Equipped with standard FOUP loading/unloading and SECS/GEM communication capabilities, the system delivers high throughput and integrates seamlessly into fully automated 300mm high-volume production lines.

Summary

With its refined fluid control and high operational stability, the CELLESTA™ -i serves as a critical wet-processing tool for 300mm production lines, ensuring consistent cleaning performance and enhanced manufacturing yields.