Accretech TSK HRG200X Fully Automatic Dual-Spindle Wafer Grinder for sale

The Accretech (Tokyo Seimitsu) TSK HRG200X is a fully automated, dual-spindle wafer grinding system designed for the high-efficiency thinning of 200mm wafers, with a focus on high rigidity and stability in mass production.

Core Positioning and Architecture

The system features a dual-spindle architecture (coarse grinding and fine grinding), allowing wafers to undergo both grinding stages sequentially within a single unit. This eliminates the need for intermediate wafer handling, thereby significantly increasing throughput and reducing the risk of wafer breakage. The high-rigidity machine frame and low-vibration spindle design ensure excellent Total Thickness Variation (TTV) control and superior surface quality.

Key Features

Full Automation: Supports wafer cassette or FOUP-based transport with automated loading and unloading. Optional in-line thickness measurement and cleaning units are available, enabling seamless integration into 200mm automated production lines.

Process Compatibility: Suitable for silicon, compound semiconductors, and hard/brittle materials. It also supports the TAIKO grinding process to mitigate edge-chipping issues.

Operation and Maintenance: Equipped with a user-friendly human-machine interface (HMI) and features such as grinding wheel life monitoring and alerts, facilitating proactive maintenance in high-volume production environments.

Summary

The HRG200X is Accretech’s primary fully automated, dual-spindle grinding system for 200mm wafers. Renowned for its stable processing precision and high throughput, it is widely used for backside thinning in the mass production of logic, memory, and power devices.