DISCO DFG8020 Wafer Grinder for sale

The DISCO DFG8020 is a fully automatic, single-spindle wafer grinding machine designed primarily for high-volume backside thinning of wafers 200mm in diameter and smaller.

Core Positioning: High-Efficiency Mass Production

Unlike the semi-automatic DAG series, the DFG8020 features fully automated wafer loading, unloading, and transport. It comes standard with the capability to process 200mm (8-inch) wafers—while also accommodating smaller sizes—and is engineered for production lines that prioritize high throughput and minimal manual intervention.

Key Technical Features

Grinding Capability: Equipped with a high-rigidity spindle, the system supports both coarse and fine grinding. It effectively controls Total Thickness Variation (TTV) and ensures high surface quality after the thinning process.

Automation and Integration: The system supports FOUPs or open wafer cassettes and allows for the integration of in-line thickness measurement and cleaning units. This minimizes the need to transport wafers between different machines, thereby reducing the risk of wafer breakage.

Applications: Widely used for the backside thinning of silicon-based logic and memory chips, as well as compound semiconductors (such as SiC and sapphire). By changing the grinding wheel, the machine can also be adapted for processing hard and brittle materials.

Summary

The DFG8020 serves as DISCO’s primary fully automatic, high-volume production tool for 8-inch and smaller wafer lines. It offers an optimal balance of throughput, precision, and footprint, making it well-suited for wafer manufacturing and packaging lines that require continuous, stable operation.