Used DISCO DAG810 Semi-automatic Single-spindle Wafer Grinder

The DISCO DAG810 is a semi-automatic, single-spindle wafer grinder designed for thinning and precision surface processing of wafers or hard, brittle materials.

Core Positioning and Operation

Officially classified as a "semi-automatic" or "manual" system, the unit requires manual loading and unloading of wafers, while core processes—such as grinding feed and thickness control—are performed automatically. Its design emphasizes a simple, compact structure with a footprint of only about 1.02 square meters, making it highly suitable for R&D laboratories or small-to-medium-scale production lines.

Key Specifications and Capabilities

Processing Size: Supports standard Φ200mm (8-inch) wafers, with the option to expand capacity to Φ300mm.

Spindle and Precision: Equipped with a 4.2kW, high-rigidity, low-vibration spindle, enabling high-precision grinding.

Applicable Materials: Beyond silicon wafers, it handles compound semiconductors, sapphire, and ceramics, as well as applications such as resin grinding for CSP/WL-CSP and the exposure of copper pillars.

Specialized Processes: Supports the TAIKO thinning process (available as an option).